With NVIDIA revealing its new generation GB300 AI chip at GTC 2025, SK HYNIX benefits as an exclusive 12-hour HBM3E supplier for the ultra blackwell, according to the South Korean media Business post.
In addition, SK Hynix could further strengthen its HBM advance, because the report suggests that its HBM4 will feed the NVIDIA, Rubin, Rubin, AI chip for a launch of the Q3.
In particular, while previous reports suggest that Micron finished its 12 -storey HBM development in September 2024 and presented samples to Nvidia and other potential customers, Business Post indicates that the company failed to guarantee the first NVIDIA supply orders.
Meanwhile, although Samsung would have received positive comments from Nvidia, he should obtain a qualification for his products at 8 layers and 12 layers at the beginning of the end of May or early June, according to Alpha economy.
Since SK Hynix began mass production of HBM3E 8 layers in March 2024 and began to produce HBM3E 12 layers in September, Samsung should need at least six more months to fully increase its HBM3E production, as Business Post noted.
About WCCFTECHGB300 will be the highest point of NVIDIA GTC 2025, with a logical structure similar to B200 but with 288 GB of HBM, taking advantage of the 12-high HBM3E stacking technology.
On the other hand, the Rubin of Nvidia is planned for production in 2026 and would include eight HBM4 batteries totaling 384 GB, according to WCCFTECH.
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(Photo credit: SK Hynix)
Please note that this article cites information Since Business post,, Alpha economy,, And WCCFTECH.