As demand for artificial intelligence continues to rise, the industry’s appetite for high-performance computer chips has become increasingly intense. According to a report from Business hoursNVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdles in its mass production plans. In response, CSP supplier Microsoft is said to have reduced its orders.
Sources within the supply chain cited by Commercial Times reveal that the problem lies in the design of the backplane connection. Test performance for cartridge connectors supplied by US Tier 1 supplier Amphenol has been suboptimal, which could delay mass production until March 2025.
The GB200 chips use TSMC’s advanced CoWoS-L packaging technology, integrating a highly complex cabinet design. However, this complexity has led to various challenges, including overheating in chip designs, leakage issues in UQDs, and now insufficient efficiency rates for copper cables. While NVIDIA announced during its recent conference call that Blackwell production is fully underway, supply constraints remain a pressing issue that the company is working to resolve with its partners.
The same report, citing supply chain sources, attributes the problem to a newly developed cartridge connector module. The significant specification upgrade of the GB200 increased production complexity, leading to low yield rates and test failures, creating a major bottleneck.
NVIDIA is actively pursuing alternative suppliers, but issues such as patent restrictions and delays in capacity ramp-up are expected to prolong resolution efforts. Although the report indicates that chip production schedules are not affected, supply chain checks indicate that Microsoft has already reduced its orders from NVIDIA by 40%, reallocating a portion to the GB300 chips whose release is planned for mid-2025.
(Photo credit: NVIDIA)
Please note that this article cites information Since Business hours.
